Micross Components Appointed as Global Specialist Die Distributor to International Rectifier
ORLANDO, Fla. and EL SEGUNDO, Calif., July 10, 2012 /PRNewswire/ -- Micross Components, a global provider of specialty electronic components, and International Rectifier, IR® (NYSE: IRF), a world pioneer in power management technology, have entered into an agreement establishing Micross as a distribution specialist for International Rectifier bare die products worldwide.
"Micross' heritage with IR dates back to the very beginning of the die business in the early 90's," says Ben White, Micross' General Manager for Die Distribution in the UK. "This new agreement with IR recognizes our long-term commitments and provides a great platform with which to promote IR die and support our global customers."
"As a leading supplier of power products in die form, we are pleased to enter into this agreement with Micross, a global provider of specialty application solutions for engineers requiring higher performance, increased ruggedization or application miniaturization," said Adam White, Senior Vice President, Worldwide Sales, International Rectifier.
About International Rectifier
International Rectifier (NYSE: IRF - News) is a world leader in power management technology. IR's analog and mixed signal ICs, advanced circuit devices, integrated power systems and components enable high performance computing and reduce energy waste from motors, the world's single largest consumer of electricity. Leading manufacturers of computers, energy efficient appliances, lighting, automobiles, satellites, aircraft and defense systems rely on IR's power management benchmarks to power their next generation products. For more information, go to www.irf.com.
About Micross Components
Micross Components is a leading global provider of distributed and specialty electronic components for military, space, medical, and demanding industrial applications. Operating as a single source for high-reliability and state-of-the-art electronics, Micross' solutions range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 30+ year heritage, Micross possesses the design, manufacturing and logistics expertise needed to support an application from start to finish. For more information, visit www.micross.com.
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