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Synaptics to Host Analyst and Investor Meeting on November 18, 2014
Global and Chinese Microplate Reader Industry Report 2014
Huntkey President Luo Wenhua Wins the 'Top 10 Leaders of Shenzhen Quality' Award
SNUPI Technologies Appoints Elizabeth Hamren to Board of Directors
Field Tests Of FUTURECAST™ Next-Gen TV Broadcast System First To Demonstrate 'Physical Layer' Capabilities Of 4K And Robust Mobile Transmission For ATSC 3.0
TCP Expands Elite Series LED Portfolio with 75 and 100-watt Replacement Bulbs
EUV Light Source Developer Adlyte Achieves Key Performance Milestone for High-Volume Manufacturing English
"Free Your Inner Tiger": Ghana's Leading Afro-Pop Star Prinze Kay Composes a Song to Promote Indiegogo and a Watershed Product called the BioSonic Encoder App
Enmetric Systems, Inc. Recognized as Cisco EnergyWise Suite Authorized Technology Provider Partner USA
Highpower International Delivers Electric Vehicle (EV) Battery System to Harbin Institute of Technology
Cokeva, Inc. Named Top Woman-Owned Business in Northern California Sacramento Region
Intilop's 16K Concurrent TCP & UDP Session Hardware Accelerator Core (TOE & UOE) Now Available for Immediate Data Center Deployment
Telect Releases $999 Standard Network Server Cabinet, Made in the USA
China EV Charging Station Market and Charging Pile Investment 2014 Research Report
Z3 Technology's Z3-DM8107-SDI2-RPS Development System Delivers Low Power H.264 Encoder Solution
MAYIM BIALIK SURPRISES WINNERS OF BACK TO SCHOOL CONTEST WITH A BIG BANG
Non-Volatile Dual In-Line Memory Module (NVDIMM) Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2014 - 2020
Rugged COM Express Carrier Board from MEN Micro Facilitates Application-specific Evaluation and Development
Home Automation Market to Surge to US$16.4 Billion by 2019: Transparency Market Research
Global and Chinese Vision Guided Robotics Industry Report 2014
Huntkey Awarded the 2014 'Typical Outstanding Enterprises of National Quality and Integrity'
Tektronix MDO3000 Named Editor's Choice by Embedded Computing Design
LG's New AC Solar Module Delivers Max Performance, Installation Flexibility
EV Group Next-Gen Nanoimprint Lithography Technology Targets Photonics, LED And Bioengineered Device Production
TI continues to scale sophisticated innovation into ADAS solutions for entry- to mid- level automobiles
Smallest and Least Expensive Truly Consumer Friendly 3D Resin Printer, The iBox Nano Launches on Kickstarter
TI strengthens DSP and vision processing on its "Jacinto" family of infotainment processors to enhance digital cockpit integration
Polycase Adds to Low-Cost Waterproof Plastic Electronics Enclosures Series
Broadcom DSL Gateway Device Enables Gigabit-class Services to and Within the Home
Apogee Introduces New Ensemble - 30x34 Thunderbolt™Audio Interface for Logic Pro X and Mac
Marvell's Kinoma Create - the JavaScript-powered IoT construction kit - gives developers a connected device prototyping platform for the modern era, because an inspiring developer experience leads to a great user experience
Marvell Showcases Comprehensive Suite of Gigabit-Ready Access Platforms for Fiber, Phoneline and Coaxial Cable Networks
LTE-Advanced Deployments Amplify Related Testing Market, Finds Frost & Sullivan
Growth of Pay TV Subscribers and Channels Propels the Global Pay TV Video Encoders Market English
SMIC Announces Third Quarter 2014 Webcast Conference Call
Canadian Solar to Participate in Upcoming Investment Conferences
Qualcomm Drives 802.11ac 2.0 Ecosystem to Bring Faster Wi-Fi Connectivity to Home Networks, Mobile Devices and Consumer Electronics
Picosun ALD Improves Inkjets
Tech Leaders and Energy Efficiency Experts Come Together in San Francisco to Explore Today's Most Pressing Energy Issues at the 2014 Emerging Technologies (ET) Summit
Ultra Clean Reports Third Quarter 2014 Financial Results
Cadence Reports Third Quarter 2014 Financial Results
ET Solar Supplies 5 MW PV Modules to a Mining Operation in Suriname Spanish Portuguese
Canadian Solar to Introduce Diamond Module at 2014 SPI
Global Unichip Corporation Uses Cadence Encounter Digital Implementation System to Complete Its First Production Design on TSMC 16FF+ Process
Media Alert: Cadence to Host Mixed-Signal Technology Summit
Smaller - Lighter - More Power - Enecsys unleashes third generation field-configurable micro inverter to fuel AC Module growth Portuguese Spanish
TI's new SimpleLink™ Wi-Fi® devices are first to be Wi-Fi CERTIFIED™ at the chip level
ISSI Debuts 20W Per Channel Stereo Class-D Amplifier
Natcore Technology Makes First Laser-Processed All-Low-Temperature Solar Cell.
Trust Automation Contributes to the Success of MacroAir AirVolution-D

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