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KLA-Tencor Reports Fiscal 2015 First Quarter Results And Announces A Plan To Pursue A Leveraged Recapitalization Featuring A $2.75 Billion Special Cash Dividend And An Expanded Stock Repurchase Program
Ingram Micro Reports Third Quarter Earnings
Accelerate control systems and increase integration while decreasing system cost with TI's new C2000™ Piccolo™ F2807x MCUs
Mentor Graphics Appoints Vice President for PCB Design
Axcelis Announces Timing Of Third Quarter 2014 Financial Results And Conference Call
Actions Semiconductor to Report Third Quarter 2014 Financial Results on November 4, 2014
Microsemi Announces Webcast and Access Information for Fiscal Fourth Quarter Earnings Conference Call
MagnaChip to Supply LG Display with Ultra HDTV Display Driver ICs
SMIC and Maxscend collaborate on 55nm RF IP platform
Photometer Market Worth $162.53 Million and Calorimeter Market Worth $252.79 Million by 2020
Early Briefing on Semiconductors Stocks - Cypress Semiconductor, STMicroelectronics, Mellanox Technologies, International Rectifier, and Avago Technologies
Multicore Processors Are Critical in the Face of Growing Data Traffic, Heavy Reading Finds English
Cephasonics Launches the cQUB-1, First Product in New Family of cQUB White-Label Ultrasound Systems Targeted at Medical Applications
EUV Light Source Developer Adlyte Achieves Key Performance Milestone for High-Volume Manufacturing English
Intilop's 16K Concurrent TCP & UDP Session Hardware Accelerator Core (TOE & UOE) Now Available for Immediate Data Center Deployment
Global Organic Electronics (Semiconductor, Conductive, Dielectric and Substrate) Market - Analysis and Forecast (2014 - 2020) English
Amtech To Acquire BTU International In An All-Stock Transaction
Broadcom Reports Third Quarter 2014 Results
MAYIM BIALIK SURPRISES WINNERS OF BACK TO SCHOOL CONTEST WITH A BIG BANG
ROHM Semiconductor's General-Purpose Automotive MCU System Power Supplies for Idling Stop Systems
Rugged COM Express Carrier Board from MEN Micro Facilitates Application-specific Evaluation and Development
SMIC Certifies Synopsys IC Validator for Signoff Physical Verification
Synopsys STAR Memory System Multi-Memory Bus Processor Enables 10 Percent Die Size Reduction for Marvell SoC
EV Group Next-Gen Nanoimprint Lithography Technology Targets Photonics, LED And Bioengineered Device Production
TI continues to scale sophisticated innovation into ADAS solutions for entry- to mid- level automobiles
Technical Notes Covering Semiconductors Equities - Analog Devices, Broadcom, Texas Instruments, Atmel, and NXP Semiconductor
TI strengthens DSP and vision processing on its "Jacinto" family of infotainment processors to enhance digital cockpit integration
Axcelis 'Purion XE' High Energy System Chosen By Leading Chipmaker In Asia Pacific Region For DRAM Manufacturing
Broadcom DSL Gateway Device Enables Gigabit-class Services to and Within the Home
Global 3D IC Market 2014-2018: Key Vendors are Advanced Semiconductor Engineering, Samsung, STMicroelectronics and Taiwan
Marvell's Kinoma Create - the JavaScript-powered IoT construction kit - gives developers a connected device prototyping platform for the modern era, because an inspiring developer experience leads to a great user experience
Broadcom Powers the Gigabit Era of DSL
Sonics Eases SoC Design Flow Integration Using Magillem IP-XACT Checker Suite
Actions Semiconductor Debuts Its First 28nm OWL Series Chipset
SMIC Announces Third Quarter 2014 Webcast Conference Call
Microsemi Announces Collaboration with Broadcom to Expand Broadband Product Portfolio for Next Gen xDSL Applications
Sanmina Corporation Invites You To Join Its Fourth Quarter And Fiscal Year 2014 Earnings Conference Call
TI reports 3Q14 financial results and shareholder returns
Ultra Clean Reports Third Quarter 2014 Financial Results
Global Unichip Corporation Uses Cadence Encounter Digital Implementation System to Complete Its First Production Design on TSMC 16FF+ Process
Media Alert: Cadence to Host Mixed-Signal Technology Summit
TI's new SimpleLink™ Wi-Fi® devices are first to be Wi-Fi CERTIFIED™ at the chip level
ISSI Debuts 20W Per Channel Stereo Class-D Amplifier
Synopsys Introduces Industry's First On-Chip Memory Test and Repair Solution for Embedded Flash
Trust Automation Contributes to the Success of MacroAir AirVolution-D
VIA Technologies Cuts Silicon Test Time by 11X Using Synopsys' DFTMAX Ultra
Camtek Schedules Third Quarter 2014 Results Release and Conference Call for Wednesday, October 29, 2014
Marvell Unveils Groundbreaking SRAM-Based Network Search Engine with Industry's Highest Capacity, Fastest Performance and Lowest Power Consumption
EZchip Semiconductor Schedules Third Quarter 2014 Results Release For Wednesday, November 12, 2014

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