Ultratech Ships 50th Laser Spike Anneal System To A Major Asian Foundry
Ultratech's LSA Tools Enable Higher Performance and Lower Leakage for High-end Mobile Devices
SAN JOSE, Calif., June 20, 2012 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced the shipment of its 50th laser spike anneal (LSA) system. Among these 50 systems, Ultratech has shipped more than 15 of its flagship LSA101 systems, which can achieve throughputs of up to 60wph. Ultratech's unique long-wavelength LSA technology enables higher performance and lower leakage for today's high-end smartphones and media tablets, and is the process tool of record at all major foundries for production of leading-edge devices.
Arthur W. Zafiropoulo, Chairman and Chief Executive Officer, noted, "The shipment of our 50th LSA system to a major Asian foundry demonstrates the positive results of our focus on delivering outstanding products and services to our customers worldwide. Utilized by leading IDMs and foundries around the globe, LSA is now implemented as the preferred technology for high-volume manufacturing of advanced logic devices from the 45- to 28-nm nodes. As the industry continues to move to sub-28-nm nodes, Ultratech is strategically positioned to meet its customers' advanced processing needs. We expect that there will be additional process steps requiring LSA technology as devices scale down, which puts the product in a strong position for long-term growth. As we mark the shipment of our 50th LSA system, we look forward to working with existing and new customers around the world in developing advanced technology that provides significant competitive advantages."
The LSA101 enables critical millisecond annealing applications for the 28-nm node and below compared to other competing millisecond annealing technologies. The LSA101 delivers superior within-die uniformity, layout-independent process results, and real-time closed-loop temperature control over the entire wafer. The system has a minimum dwell time of 200 microseconds, which minimizes overlay errors for devices with aggressive strain engineering. This reduced dwell time capability, along with excellent process control, allows customers to maintain high processing temperatures, and thus achieve improved device performance, lower leakage, and improved yield. Finally, with a maximum throughput of 60wph the LSA101 is an example of Ultratech's commitment to continue to develop advanced technology systems that provide economic advantages to its global customers.
Certain of the statements contained herein, which are not historical facts and which can generally be identified by words such as "anticipates," "expects," "thinks," "intends," "will," "could," "believes," "estimates," "continue," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to timing, delays, deferrals and cancellations of orders by customers, including as a result of semiconductor manufacturing capacity as well as our customers' financial condition and demand for semiconductors; demand for consumer devices; industry growth within the company's served markets; continued delivery of financial performance and value; cyclicality in the semiconductor and nanotechnology industries; our dependence on new product introductions and market acceptance of new products and enhanced versions of our existing products; lengthy sales cycles, including the timing of system installations and acceptances; quarterly revenue fluctuations; lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; general economic and financial market conditions including impact on capital spending, as well as difficulty in predicting changes in such conditions; rapid technological change and the importance of timely product introductions; customer concentration; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; changes in pricing by us, our competitors or suppliers; international sales and operations; timing of new product announcements and releases by us or our competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; effect of capital market fluctuations on our investment portfolio; ability and resulting costs to attract or retain key personnel; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon our achieving and maintaining profitability and the market price of our stock; mix of products sold; outcome of litigation; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; changes to financial accounting standards; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; foreign government regulations and restrictions; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on the economy, in general, or on our business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2011 and its Quarterly Report on Form 10-Q for the quarter ended March 31, 2012. Due to these and additional factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. These forward-looking statements are based on management's current beliefs and expectations, some or all of which may prove to be inaccurate, and which may change. We undertake no obligation to revise or update any forward-looking statements to reflect any event or circumstance that may arise after the date of this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, manufactures and markets photolithography and laser processing equipment. Founded in 1979, the company's market-leading advanced lithography products deliver high throughput and production yields at a low, overall cost of ownership for bump packaging of integrated circuits and high-brightness LEDs (HB-LEDs). A pioneer of laser processing, Ultratech developed laser spike anneal technology, which increases device yield, improves transistor performance and enables the progression of Moore's Law for 32-nm and below production of state-of-the-art consumer electronics. Visit Ultratech online at: www.ultratech.com.
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