John Vincent joins Diablo Technologies as Vice President of Engineering
OTTAWA, June 25, 2012 /PRNewswire/ - Diablo Technologies is pleased to announce that John Vincent has joined the company as Vice President of Engineering. In his new role, John will be responsible for managing Diablo's engineering staff and guiding the company's product development.
"John's demonstrated leadership in the development and integration of cutting-edge technologies will be an invaluable asset to Diablo. His experience and skills will be key as we roll out innovative and game changing products into the enterprise industry," said Riccardo Badalone, Diablo Technologies CEO. "John's extensive ASIC and system development experience will strengthen our company, help maintain our tradition of engineering excellence and ensure we can deliver successfully to our customers."
John has been at the center of complex ASIC and system development since his contributions at Nortel Networks in the mid 90`s. Most recently, John was the Director of R&D at Huawei's Ottawa Design center, responsible for leading the ASIC design activities. Prior to joining Huawei he held the position of VP of Engineering at Edgewater Computer Systems and Director of Design Engineering for the Altera Ottawa Technology Center. He was previously Vice President of Engineering at Silicon Access Networks, a network processor startup. John holds 10 patents in the areas of switch architecture, algorithms for networking applications, and traffic management. He is a graduate of the University of Waterloo, with a B.A.Sc. in Electrical Engineering.
"I was drawn to Diablo because of its technology and the exciting new products that are being developed." John commented. "This is an exciting time, as more and more customers realize the potential of Diablo's solutions to transform the server industry and advanced computer architecture. I look forward to growing the engineering team, building on the company's momentum in the marketplace."
Diablo Technologies is a leading provider of high-performance memory bridging solutions. The company's innovative chip solutions alleviate processor bottlenecks by enabling accelerated access to larger pools of memory and I/O cache. The result is full utilization of system processing power and significant increases in application performance.
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