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TI reports 1Q14 financial results and shareholder returns
LSI Reports First Quarter 2014 Results
Ultra Clean to Present at the Jefferies 2014 Global Technology Media and Telecom Conference
Codasip Secures $2.8 Million First Round of Funding, Led by Credo Ventures
ITRenew To Showcase ITAD Services and Teraware Data Sanitization Software at IAITAM 2014 Annual Conference and Exhibition
Lightwave Logic Develops Powerful New Electro-Optical Material System, Perkinamine Malachite™, Based on the Company's New Multi-Chromophore Approach
Synopsys Announces Industry's First Complete LPDDR4 IP Solution for High-Performance, Low-Power Mobile SoC Designs
Synopsys' New ProtoCompiler Software Speeds Time to First Prototype by Up to 3X
Mentor Graphics Analog Characterization Environment Selected by Alps Electric for Complex Mixed-Signal ICs
UMC Certifies Synopsys IC Validator Physical Verification Tool for 28 nm
Multi-System Follow-On Order Received For Axcelis Optima HDx High Current Implanter
Actions Semiconductor to Report First Quarter 2014 Financial Results on May 6, 2014
Sanmina Reports Second Quarter Fiscal 2014 Results
Lemelson Capital Management announces stake in Kulicke and Soffa Industries, delivers letter to management and board members urging immediate share repurchase
Contour Semiconductor Names Former Intel and Fusion-IO Exec New CEO
Sonics Expands Market Lead in Network-On-Chip
SunEdison Names Jose Perez President Of Europe, Africa And Latin America Spanish
TI brings leading Bluetooth® Smart technology to automobiles for smartphone and wire-replacement applications
Electric Cloud Completes Over-Subscribed $12 Million Round of Funding
Xilinx Recognizes TSMC with Best Supplier Award
Cadence Reports First Quarter 2014 Financial Results
Cadence to Expand Verification Solution with Acquisition of Jasper Design Automation
Markets for Silver Nanomaterials as Transparent Conductors
ARM Implements the Cadence Library Characterization Solution for Advanced Node Foundation IP Development
SunEdison Closes on 20 MW Adobe Solar Plant
Xilinx and Open-Silicon Announce Hybrid Memory Cube Controller IP for All Programmable FPGAs
Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs
Semiconductor Clock and Timing Report & Analysis CY2013 - Q1 CY2014
Digital Entertainment in the Home: Technologies and Global Markets
Handset Semiconductor Trends
United States Flashlight Market Forecast and Analysis
Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market 2014-2018
ASE Files 2013 Annual Report on Form 20-F
Semiconductor (Silicon) IP Market by Form Factor, Design Architecture, Processor Type, Application, Geography and Verification IP - Forecast & Analysis to 2013 - 2020
Global Automotive Battery Market Report
Silicon Labs Si504 - CMEMS Oscillator
Tactus and Wistron Announce Strategic Manufacturing Partnership
Mentor Graphics Veloce Emulation Platform Selected by Imagination Technologies for IP Verification Based on Performance and Capacity
Microsemi Announces Webcast and Access Information for Fiscal Second Quarter Earnings Conference Call
Toshiba Debuts World's Fastest microSD Memory Cards
Texas Instruments board declares quarterly dividend
ISSI Announces Fiscal 2014 Second Quarter Conference Call
Spansion to Announce First Quarter Financial Results on May 6, 2014
MegaChips and Vidatronic execute Joint Development Agreement
Microchip President and CEO Steve Sanghi to Provide Entrepreneurs Real World Insight at TiE Arizona's Global Thought Leader Lecture
Texas Instruments to sponsor United Way of Metropolitan Dallas "Nine for 90" community service projects
Ultra Clean to Announce First Quarter 2014 Results
Automotive Semiconductor Trends
REFUsol 020K-SCI 20 KW PV Inverter using SiC transistors

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