Reverse Costing Reports for Tablet and Smartphone Components Give Competitors in the Mobile Sector an Edge
FARMINGTON, Conn., June 5, 2012 /PRNewswire-iReach/ -- "Reverse Costing" is the process of disassembling a device into its component parts in order to identify the core technology within and calculate the cost to manufacture the device. The results of Reverse Costing studies can be used to pre-analyze the cost of potentially expensive projects at a Research and Development level, to enhance the negotiation power of purchasing managers, and to benchmark competitors' products.
Global Information Inc is pleased to offer, in cooperation with partner firm System Plus Consulting, two significant and detailed new reverse costing analyses:
Qualcomm mirasol Display New generation MEMS Interferometric Modulator Reverse Costing Analysis
System Plus Consulting's May 2012 reverse costing report on Qualcomm's new MEMS IMOD displays offers a detailed teardown of a key component for next-generation e-ink e-readers. The Mirasol display from Qualcomm has unique characteristics, straddling the line between conventional LCD and modern e-ink technologies.
The Mirasol display uses a reflective technology called Interferometric Modulation (IMOD), with MEMS structures at its core. Each pixel contains reflective micro-membranes. This technology is bi-stable, meaning it is very low power and highly reflective. The display can be seen in direct sunlight, and eye strain is lower than with LCD. With color images and a high refresh rate (30 FPS video) Mirasol offers more possibilities than the e-Ink technology.
The display is part of Kyobo's e-reader, the first 5.7" e-reader integrating a Mirasol color display, but this display is suitable for various applications including e-readers, mobile phones and other portable devices.
This report provides complete teardown of the Qualcomm Mirasol display with sections offering detailed photos, material analysis, manufacturing process flow, in-depth economical analysis, and a manufacturing cost breakdown.
This report is available immediately from Global Information, Inc. A table of contents and sample of the report are available at: http://www.giiresearch.com/report/spc239572-qualcomm-mirasol-display-new-generation-mems.html
STMicroelectronics: World's first Inertial MEMS using Through-Silicon-Via technology Reverse Costing Analysis
System Plus Consulting also has also published their reverse costing report of the world's first 3-Axis MEMS accelerometer, supplied by STMicroelectronics and using through-silicon via (TSV) technology.
The accelerometer component was extracted from a Nokia phone and appears to be a special version of the STM 3-Axis Accelerometer LIS302DL. Packaged in a LGA-14 pin package, this device integrates two dies in a side-by-side configuration. The component also features ultra low-power consumption, which makes it attractive for consumer applications that require power-saving functionality.
By removing the area reserved for I/O pads, the TSV process has allowed the MEMS die area to be significantly reduced compared to the area of a standard accelerometer. The manufacturing process uses an approach similar to the standard Technology-Centered Electric Mobility Assessment (THELMA) technology, but does include significant changes that increase the ultimate wafer cost.
For comparison, this report also provides a competitive analysis of the standard ST 3-Axis MEMS Accelerometer, the LIS302DL.
This report is available immediately from Global Information, Inc. A table of contents and sample of the report are available at: http://www.giiresearch.com/report/spc235108-stmicroelectronics-worlds-first-inertial-mems.html
About Global Information Inc. Global Information (GII) (http://www.giiresearch.com) is an information service company partnering with over 300 research companies around the world. Global Information has been in the business of distributing technical and market research for more than 25 years. Expanded from its original headquarters in Japan, Global Information now has offices in Korea, Taiwan, Singapore, Europe and the United States.
Media Contact: Jeremy Palaia Global Information, Inc., 1-860-674-8796, Press@gii.co.jp
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