Electronic Design Automation Headlines from PR Newswire

< Go Back

Hollysys Automation Technologies to Participate in Upcoming Investor Events
MFLEX Invites The Public To Join Its Fiscal 2014 Fourth Quarter And Full-Year Financial Results Conference Call And Webcast On November 6, 2014
Altera Announces Third Quarter Results
Accelerate control systems and increase integration while decreasing system cost with TI's new C2000™ Piccolo™ F2807x MCUs
Cadence Announces Broad Portfolio of 3D Memory Verification IP
SomaTone Interactive Forges New Collaboration with Immersion Corporation to Bring Immersive Tactile Effects to the Mobile Video Games Industry
Benchmark Electronics Results Exceed Third Quarter Guidance
API Design Pioneer announces Apiary for Enterprise
Cadence Introduces Automotive Functional Safety Verification Solution, Reducing ISO 26262 Compliance Preparation Effort by up to 50 Percent
Intilop's 16K Concurrent TCP & UDP Session Hardware Accelerator Core (TOE & UOE) Now Available for Immediate Data Center Deployment
eRelevance Partners with Dental Health Management Solutions (DHMS)
iRobot Reports Third-Quarter Financial Results
Home Automation Market to Surge to US$16.4 Billion by 2019: Transparency Market Research
IEEE Announces The Future of Identity Series at SXSW® 2015
SMIC Certifies Synopsys IC Validator for Signoff Physical Verification
Synopsys STAR Memory System Multi-Memory Bus Processor Enables 10 Percent Die Size Reduction for Marvell SoC
TI continues to scale sophisticated innovation into ADAS solutions for entry- to mid- level automobiles
TI strengthens DSP and vision processing on its "Jacinto" family of infotainment processors to enhance digital cockpit integration
Apogee Introduces New Ensemble - 30x34 Thunderbolt™Audio Interface for Logic Pro X and Mac
TI reports 3Q14 financial results and shareholder returns
Cadence Reports Third Quarter 2014 Financial Results
TI's new SimpleLink™ Wi-Fi® devices are first to be Wi-Fi CERTIFIED™ at the chip level
Synopsys Introduces Industry's First On-Chip Memory Test and Repair Solution for Embedded Flash
VIA Technologies Cuts Silicon Test Time by 11X Using Synopsys' DFTMAX Ultra
iRobot receives $7.6 million order from the U.S. Navy
WaferGen Bio-systems Announces the Launch of Exome Capture Solutions on Its Next Generation Sequencing (NGS) Sample Preparation Platform Apollo 324™
Altera Demonstrates Automotive Embedded System Solutions that Increase Design Productivity at SAE Convergence 2014
Hollysys Automation Technologies Announces SCADA Bidding Win of Tianjin Subway Line 5 Valued at USD $13.88 Million
Xilinx Highlights All Programmable Processing Solutions for Carrier and Enterprise Communications at Linley Processor Conference 2014
Xilinx Announces Q2 Fiscal 2015 Results; EPS $0.62
Altera Announces Third Quarter Earnings Conference Call
TI introduces industry's first fully integrated LED matrix manager for adaptive automotive headlight systems
Media Alert: Cadence to Showcase Automotive Application Solutions at SAE 2014 Convergence Conference and Exhibition
Building Information Modeling Market Worth $8,646.47 Million by 2020
Industrial Automation Market: F&B, Chemicals and Petrochemical Industry 2014 - 2018 Global Analysis
Altera Expands Automotive-Grade Product Portfolio with Highly Integrated PowerSoCs
Cadence Announces Industry's First Multi-Protocol DDR4 and LPDDR4 IP Solution
$225B+ Smart Factory Market (Automation) Analysis and 2018 Forecasts
Industrial Automation Control Market in the Americas 2014-2018: Key Vendors are ABB, Honeywell, Rockwell and Siemens
Evana Automation Ships Custom Assembly and Test System to Tier 1 Automotive Supplier
Industry's first 24-V, sinusoidal, sensorless, brushless DC motor driver quiets noise in fan and small pump applications
U.S. Army Testing Lockheed Martin Upgrades To Battlefield Intelligence Enterprise
Smart and Connected Offices Market Worth $43.31 Billion by 2020
New DesignWare ARC HS38 Processor Doubles Performance for Embedded Linux Applications
Synopsys Enables Superior Verification Planning and Coverage Analysis with Verdi Coverage
TI demonstrates leadership in copper wire bonding technology with more than 22B units shipped
Global Service Robot Market: 16.5% CAGR to 2018, Technology and Market Trends Analysis
Jack Henry Banking Continues Outsourcing Migration Trend among Existing Core Clients
Xilinx and SAI Technology Announce Availability of First All Programmable Software Defined Radio Reference Design for LTE User Equipment

< Prev Next >
PR Newswire - United Business Media